Cornell University
School of Electrical and Computer Engineering
ECE 5970 Chip-Level Interconnection Networks
Spring 2010
Prof. Christopher Batten
207 Upson Hall • Tuesday and Thursday • 10:10–11:25am
home | details | schedule | projects
Low-Radix and Low-Diameter 3D On-Chip Network
Y. Xu, Y. Du, B. Zhao, X. Zhou, Y. Zhang, and J. Yang. "A Low-Radix and Low-Diameter 3D Interconnection Network Design." International Symposium on High-Performance Computer Architecture (HPCA), February 2009.
- Discussion: April 13
- Online Copy: xu-low-radix-3d-ocn-hpca2009.pdf (link)
- Related Paper: kim-3d-ocn-isca2007.pdf (link)